A managed and strategic sourcing strategy for direct
materials can pay great dividends in savings over the lifetime of a
specific product line, but tends to be more technically involved and have a
higher time commitment.
The gathering of technical specifications will usually take
up the most upfront time. Interdepartmental communication within this phase of
the sourcing process is critical in order to understand the hard requirements
of the specifications as well as areas of flexibility.
For machined parts this will involve gathering a PDF drawing
for each component for initial conversations with the machine shops, as well as
design files in a generic 3D CAD format such as STEP (Standard for the Exchange
of Product) which is in an ISO standard exchange format. Factors to consider
may include tolerancing of critical dimensions, geometries of individual
features, and material specifications and finishes.
In addition to engaging
with the suppliers when initiating the relationship and during
revisions of the drawings, frequent requoting with both the incumbent and a set
of alternate suppliers can be a key factor in understanding the true
competitive market costs.
When working with electronics parts such as Printed Circuit
Board Assemblies (PCBA) the process becomes more involved due to not only
maintaining the most current revision of electronic design files such as Gerber
files, but also the management of individual off-the-shelf component specifications
and availability, obsolescence, and substitution concerns.
The Gerber design files form the basis of the conversations
with EMS (Electronic Manufacturing Services) suppliers and the quoting process,
since they are in a generic ASCII vector format for 2D binary images of the
circuit board's copper layers, solder mask, silkscreen, and drill data and can
be read by any supplier independent of the original design program. PDF files
describing the board's layout, schematic data, and fabrication requirements are
also required for a complete and accurate quote.
Along with the design information a BOM (Bill Of Materials)
is also provided to list each component of the board assembly. Within the BOM,
passive electronic components that do not control current through a command
signal are listed and may include capacitors, resistors, inductors,
transformers, and filters. These components are usually more open to
substitution, but sometimes have a critical tolerance value and any alternates
need to be validated by the Engineering design team. The active components,
which do control current, are more critical and can include most
ICs/transistors/semiconductor devices, sensors, display devices, vacuum tubes,
and silicon-controlled rectifiers. Active components have firm requirements due
to design constraints and may be in short supply at times or need to go through
a thorough end of life cycle upon obsolescence. This can include purchasing
through brokers, negotiating directly with the manufacturer to ensure supply,
purchasing a bulk supply to ensure a transition period, and working closely
with the Engineering design team to validate an appropriate substitute and
ensure a smooth transition to the new component.
Therefore, by dedicating the initial time necessary to
gather all specifications and understand the constraints of the design, a
program can be developed to provide year over year savings by requoting parts
to maintain competitive pricing and utilize substitution and negotiation
strategies with suppliers when individual part costs begin to rise.
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